1Department of Biotechnology Engineering, Kulliyyah of Engineering, International Islamic University Malaysia (IIUM), 53100 Kuala Lumpur, Malaysia
2DIC Compounds Sdn. Bhd., Lorong Perusahaan Baru 2, Kawasan Perusahaan Perai, 13600 Perai, Penang, Malaysia
3Department of Science in Engineering, Kulliyyah of Engineering, International Islamic University Malaysia (IIUM), 53100 Kuala Lumpur, Malaysia
4 Department of Manufacturing and Materials Engineering, Kulliyyah of Engineering, International Islamic University Malaysia (IIUM), 53100 Kuala Lumpur, Malaysia
BibTex Citation Data :
@article{IJRED47260, author = {Muhamad bin Zamli and M. H. Maziati Akmal and Farah Ahmad and Firzanah Hisham}, title = {Piezoelectric Performance of Microbial Chitosan Thin Film Derived from Aspergillus oryzae}, journal = {International Journal of Renewable Energy Development}, volume = {11}, number = {4}, year = {2022}, keywords = {Aspergillus oryzae; biopolymer; chitosan; deacetylation; fungi; piezoelectric; thin film}, abstract = { In this study, chitosan thin film derived from Aspergillus oryzae cell walls was fabricated and characterised. First, the chitosan from the fungal biomass was extracted (0.18 g/g) with 52.25% of degree of deacetylation obtained through Fourier transform infrared (FTIR) spectroscopy. Subsequently, several parameters of the chitosan thin film fabrication were optimised, including chitosan solution volume and drying temperature. Resultantly, the highest mechanical quality factor (3.22±0.012), the lowest dissipation factor (0.327±0.0003) and the best tensile strength (13.35±0.045 MPa) were obtained when pure chitosan was dissolved in 35 ml of 0.25 M formic acid and dried at 60 ˚C. In addition, the scanning electron microscopy (SEM) analysis presented a fine chitosan agglomerate distributed in the formic acid. The optimised fabricated, fungal-derived chitosan thin film was validated, recording a mechanical quality factor of 3.68 and dissipation factor of 0.248; both values were comparable to the synthetic polymer, polyvinylidene fluoride (PVDF) thin film. Thus, fungal-derived chitosan thin film can potentially be used as a piezoelectric material. }, pages = {1157--1164} doi = {10.14710/ijred.2022.47260}, url = {https://ejournal.undip.ac.id/index.php/ijred/article/view/47260} }
Refworks Citation Data :
In this study, chitosan thin film derived from Aspergillus oryzae cell walls was fabricated and characterised. First, the chitosan from the fungal biomass was extracted (0.18 g/g) with 52.25% of degree of deacetylation obtained through Fourier transform infrared (FTIR) spectroscopy. Subsequently, several parameters of the chitosan thin film fabrication were optimised, including chitosan solution volume and drying temperature. Resultantly, the highest mechanical quality factor (3.22±0.012), the lowest dissipation factor (0.327±0.0003) and the best tensile strength (13.35±0.045 MPa) were obtained when pure chitosan was dissolved in 35 ml of 0.25 M formic acid and dried at 60 ˚C. In addition, the scanning electron microscopy (SEM) analysis presented a fine chitosan agglomerate distributed in the formic acid. The optimised fabricated, fungal-derived chitosan thin film was validated, recording a mechanical quality factor of 3.68 and dissipation factor of 0.248; both values were comparable to the synthetic polymer, polyvinylidene fluoride (PVDF) thin film. Thus, fungal-derived chitosan thin film can potentially be used as a piezoelectric material.
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